Electric Soldering Irons | 10cc PCB Reballing Solder Flux Paste for Phone IC Chips Repair

Description

Product Description
Features:
This solder paste is a high viscosity no-clean flux, it can be used for PCB, SMD, reworking, it can be used for soldering and reballing of computer and phone chips. It is a necessary material for repairing the mobile phone and other kind electronic’s mainboard..
It is the mixture of high-quality alloyed powder and resinic pasty flux , it can avoid the pale yellow residue, so you are easy to clean the board.
Help to repair the circuit boards and protect the electronic components.
Product application:
Applicable to sensors, wires, motors, safety pipes, connectors, metal shells, lighting, electronic components, SMT maintenance, BGA chip implantation, etc.
NC-559: In order to wash-free solder paste, the residue color is very light and has a very high SIR value. It is recommended to be used for repairing and repairing spherical array solder joints such as BGA and CSP.
Specifications:
Material: ABS Shell
Compound ingredients: ointment
Type: wash-free
Volume: 10cc
Product weight: 20g
Size: 100*33*23mm/3.94*1.3*0.91"
Notes:
1. Due to the different monitor and light effect, the actual color of the item might be slightly different from the color showed on the pictures. Thank you!
2. Please allow slight measuring deviation due to manual measurement.
Package Content:
1 X Reballing Solder Flux Paste